Magazine and Substrate Handling for Ultra-clean Processing
Helbling Technik developed a magazine and substrate handling system for the stand-alone version of a plasma-cleaner.
Characterization of the magazine and substrate handling system:
Starting from an I/O buffer station for the magazines, batches of substrates are transported into the process chamber, cleaned in a plasma environment, and returned to the magazine.
Our tasks included:
- Conception of the system in close collaboration with our client
Dimensioning calculations - Development of the system and preparation of production documents
- Production and assembly accompanied by an external system contractor
- Revision and adaptation for series production
Customer: international company in the semiconductor market
