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High power packaging
Initial situation
In a temperature critical application optimal heat dissipation is necessary to ensure stable operating conditions for all components.
Task
The previous "low temperature" circuit is to be transferred to a board with heat-sink technology, so several components had to be replaced.
Procedure
- Determination of the critical components
- Definition of heat disipation requirements
- Preparation of the replacement concept with the manufacturer
- Circuit porting onto the new carrier
- New dimensioning of cirtical components and coordination with the manufacturer
Processe time
About 6 months
Result
Successful component group tests applying high temparatures
Client: automotive OEM supplier
